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Which consequence results when water boils inside vacuum-sealed electronic instruments?

A)Increased thermal runaway risk develops
B)Decreased risk internal arcing
C)Higher resistance solder joints form
D)Amplified electromagnetic interference shielding

💡 Explanation

Increased thermal runaway risk develops because reduced pressure lowers water's boiling point, activating the mechanism called evaporative cooling which removes less heat. Therefore component temperatures increase, rather than the decreased heat transfer expected under normal air-cooled conditions.

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