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Which mechanism causes unwanted radio frequency noise injection into integrated circuits under load?

A)Electromagnetic Induction from bond wires
B)Resistive heating causing thermal runaway
C)Capacitive crosstalk inside digital buffers
D)Substrate doping variations enable charge leakage

💡 Explanation

Electromagnetic induction injects noise because alternating currents through bond wires generate magnetic fields, which induce currents into nearby circuit traces. Therefore, EMI is the root cause rather than heating, capacitance, or substrate leakage in this particular configuration.

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