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Which outcome during rapid sublimation causes decreased equipment lifespan?

A)Latent heat extraction lowers temperature
B)Sublimation increases gas partial pressure
C)Redeposition induces crystalline microstress
D)Increased solid density lowers vapor pressure

💡 Explanation

Redeposition on nearby surfaces causes crystalline microstress because sublimation involves phase transitions followed by vapor deposition onto surfaces. Crystalline growth is rarely perfectly even; therefore, internal stresses accumulate rather than even dispersion during the transitions.

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