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Which outcome occurs when thermal stress causes epoxy polymer breakdown in a structural adhesive?

A)Reduced molecular chain entanglement
B)Increased degree of polymerization
C)Enhanced glass transition temperature
D)Crystallization of the crosslinks

💡 Explanation

Reduced molecular chain entanglement occurs because thermal stress breaks the intermolecular bonds disrupting the physical crosslinks in the epoxy network. Therefore, adhesive strength decreases, rather than strengthening due to polymerization or crystallization.

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