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Which risk escalates at bonded diamond interfaces during extreme pressure?

A)Graphitization via sp3 bond rearrangement
B)Increased quantum tunneling probability
C)Decreased electron-phonon coupling strength
D)Phonon scattering rate diminishing sharply

💡 Explanation

Localized stress at junctions causes graphitization because interfacial sp3 bonds convert into weaker sp2 π-bonds during mechanical compression. This graphitization, rather than altering quantum mechanics, therefore weakens rather than strengthened bonding.

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