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Which risk increases concerning Mughal pietra dura when cyclical temperature variations induce differential rates?

A)Adhesive bond failure
B)Efflorescence formation
C)Oxidation rate increase
D)Surface gloss reduction

💡 Explanation

Delamination risk increases because thermal expansion mismatch causes shear stress at the adhesive boundary, a process called interfacial decohesion, therefore the tesserae may detach, rather than experiencing chemical reactions or changing surface properties which are separate issues.

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