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← ScienceWhich risk increases inside integrated circuit cavities awaiting solder reflow?
A)Copper electromigration within transistors
B)Dendritic growth from residual moisture✓
C)Oxidation rate of exposed bondpads
D)Increased thermal carrier mobility
💡 Explanation
Dendritic growth accelerates between closely spaced conductors due to residual moisture; capillary condensation raises the concentration of ionic contaminants. Therefore, dendritic growth increases within confined spaces, because electrodeposition of metal ions is enhanced, rather than thermal effects or other changes.
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