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Which risk increases significantly as temperature cycles drive stress within a polycrystalline metal lattice?

A)Enhanced electron mobility
B)Creep void nucleation
C)Increased thermal diffusion
D)Improved corrosion resistance

💡 Explanation

Cycling temperatures cause repeated expansion and contraction in grain boundaries, initializing creep void nucleation; because of coefficient differences. This stress aggregation leads to material failure, rather than enhanced electron mobility or corrosion resistance at these boundaries; therefore promoting voids.

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