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Which risk increases strongly with excessively thin silicon gate oxides used to form Field Effect Transistors?

A)Increased electron quantum tunneling
B)Reduced thermal energy dissipation
C)Increased hole mobility channel length
D)Reduced impedance matching SWR

💡 Explanation

Increased gate leakage current becomes problematic because the thinness enhances electron quantum tunneling across the insulating oxide layer. This leads to increased power consumption rather than reducing noise, thus it's tunneling, not effects on hole-mobility.

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