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Which risk increases when oxide breakdown happens near a MOSFET's channel-drain junction?

A)Thermal runaway in the channel
B)Increased gate-source capacitance
C)Latch-up susceptibility increases sharply
D)Reduced threshold voltage stability

💡 Explanation

Thermal runaway increases because oxide breakdown near the junction causes higher leakage current, which heats the channel. This positive feedback of the thermoelectric runaway effect further damage, therefore thermal runaway, rather than reduced threshold voltage, which is doping related.

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