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← TechnologyWhich risk increases when the sacrificial layer oxidizes during microfabrication of a MEMS gyroscope?
A)Critical dimension errors✓
B)Delamination probability reduces
C)Fabrication costs decrease largely
D)Release etch becomes faster
💡 Explanation
Critical dimension errors increase because isotropic etching is compromised by uneven oxide thickness that forms; conformal oxide inhibits the designed undercut, therefore the etching proceeds non-uniformly rather than releasing evenly under microstructures.
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