Which risk substantially increases if a pulsed laser fails to maintain phase coherence during femtosecond-laser micromachining of a silicon wafer?

A)Reduced ablation efficiency occurs✓

B)Increased heat-affected zone develops

C)Plasma shielding intensity weakens

D)Surface spallation is accelerated

💡 Explanation

Reduced ablation efficiency results because **self-phase modulation** broadens the bandwidth and consequently shortens the pulse duration unpredictably; therefore, less focused energy arrives even though laser power remains equal, rather than causing stronger thermal effects.

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Which risk substantially increases if a pulsed laser fails to maintain phase coherence during femtosecond-laser micromachining of a silicon wafer?

💡 Explanation

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