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Which outcome occurs when a high-intensity laser ablates a crystalline silicon wafer?

A)Formation of amorphous structural defects
B)Increased long-range crystalline order
C)Decreased thermal diffusivity gradients
D)Enhanced piezoelectric charge generation

💡 Explanation

When a high-intensity laser ablates the silicon, rapid heating and cooling cause a breakdown in the crystal structure through the mechanism of rapid solidification. This results in amorphous regions near the ablation site because the atoms lack sufficient time to arrange into a crystalline lattice; therefore structural defects form rather than increased order.

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